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Winbond Q3 EPS of NT$7.58 Hits Record High, NT$73.1 Billion Expansion

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Driven by surging AI server demand and higher memory prices, Winbond posted Q3 consolidated revenue of NT$82.331 billion, up 37.6% QoQ and 278.2% YoY, with gross margin of 70.6% and net profit after tax of NT$35.422 billion, or EPS of NT$7.58. The board approved a NT$73.1 billion budget to expand the Kaohsiung Module B fab.

Q3 Revenue and Profit Hit Records

Winbond held its Q3 earnings call, with single-quarter revenue and profit both hitting records on surging AI server demand and sharp increases in memory prices. Q3 consolidated revenue reached Tah Hsin NT$82.331 billion, up 37.6% QoQ and 278.2% YoY; single-quarter gross margin broke through 70% to 70.6%; net profit attributable to parent was NT$35.422 billion, single-quarter EPS was NT$7.58, and cumulative EPS for the first three quarters reached NT$15.32.

Product Mix Shifts Toward High-Margin Memory

Executive Vice President Fan Hsiang-Yun noted that as memory prices rose sharply, the company's revenue mix shifted strongly. In Q3, product revenue shares were 58% from customized memory business, 32% from flash memory, and 9% from logic products Nuvoton Technology. In the core memory business, Q3 memory gross margin reached 73.9%, operating margin reached 59.8%, and wafer fab utilization remained at nearly 100% full loading throughout the quarter.

NT$73.1 Billion for Kaohsiung Module B Expansion

Winbond announced that the board has approved a capital expenditure budget of up to NT$73.1 billion for the Module B expansion at the Kaohsiung fab, covering construction, electrical and mechanical works, and reservations for long-lead-time equipment, laying out long-term supply capacity for after 2027. General Manager Chen Pei-Ming said monthly capacity at Kaohsiung Module A will be filled to 24K by year-end and remain fully loaded next year and the year after; Module B is scheduled to break ground on December 29, with cleanroom monthly capacity planned at 50,000 to 60,000 wafers and full adoption of the 16nm process. 16nm has started tape-out from year-end and is expected to contribute more than 40% of revenue in H2 2027.

Advanced Technology and Acquisition Progressing Well

On advanced technology, Chen Pei-Ming said 3D DRAM CUBE technology is progressing well and is expected to enter mass production in 2027 as scheduled. As for the acquisition of Infineon's NOR Flash and F-RAM business, antitrust reviews in various countries are underway, with closing expected in H2 2027. The team will operate as the independent brand Spansion in the future, advancing on a dual track with Winbond. Looking ahead, although traditional consumer electronics will see a seasonal correction in Q4, AI demand is extremely strong, and as customer contract prices are raised, the industry expects memory supply-demand tightness in 2027 to 2028 to be even more severe than in 2026.

FAQ

How did Winbond perform in Q3?

Q3 consolidated revenue was NT$82.331 billion, up 37.6% QoQ and 278.2% YoY, with gross margin of 70.6%, net profit after tax of NT$35.422 billion, single-quarter EPS of NT$7.58, and cumulative EPS of NT$15.32 for the first three quarters.

Where will the NT$73.1 billion capex be used?

It will be used for the Kaohsiung Module B expansion, including construction, electrical and mechanical works, and reservations for long-lead-time equipment, with cleanroom monthly capacity planned at 50,000 to 60,000 wafers on the 16nm process, with groundbreaking scheduled for December 29.

What is Winbond's outlook on the memory market?

The company sees a seasonal Q4 correction in consumer electronics, but strong AI demand and rising contract prices, and expects supply-demand tightness in 2027 to 2028 to be more severe than in 2026, focusing on high-margin strategic customers.